The DUALAM™ Launch Event 2025 took place on 23 April 2025, with product launches and presentations held at Tasek Puteri Golf & Country Club, followed by a live demonstration of the lamination process at Foraypack Industry Sdn Bhd. DIC Malaysia proudly introduced the DUALAM™ adhesive technology to valued partners, customers, and industry peers, from Malaysia, Indonesia and Vietnam.
The morning event commenced with welcome speeches by Mr. Kenn Chen (SBU Head Indochina & MD – DIC Malaysia) and Mr. Tokushi Kawasaki (Product Manager, Adhesives – DIC Corporation), followed by product presentations from Mr. Alvin Tso (Deputy Marketing Director – Sinomech Corporation) and Mr Masamitsu Arai (Regional Technical Manager Adhesives – DIC Graphics Thailand).
The sessions featured insightful information on laminating adhesive machines, solventless lamination technology, DUALAM™ adhesive innovations, and conventional adhesive solutions.
In the afternoon, guests were organized into small groups to witness first-hand the performance, efficiency, and technical advantages of DUALAM™ in a real production environment at Foraypack Industry Sdn Bhd.
The day concluded with closing remarks from Mr. Kenn Chen:
