On October 8, 2024, PT DIC Graphics Indonesia (DICG ID) participated in the 2024 Flexible Packaging Event in Jakarta, hosted by BOBST. This event brought together key industry players to discuss innovations, technologies, and trends shaping the flexible packaging industry – and its impact in the Indonesian market.
Event Highlights:
- David Robins from DIC shared insights on Flexible Packaging Technology Innovations: Extended Color Gamut (ECG), cost-efficient high-color-density inks, and barrier solutions in adhesives & coatings.
- Explored BOBST Connect in action – a cloud-based platform for data-driven packaging production and many more advanced solutions!
- Interactive discussion on packaging industry trends specific to the Indonesian market.
Main Takeaways from David Robins’ Sharing:
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The 2024 Flexible Packaging Event in Jakarta showcased the latest technological advancements and industry trends. With continued collaboration, DIC remains focused on addressing the evolving needs of the packaging industry in Indonesia and beyond.
